型号/品牌/封装
品类/描述
库存
价格(含税)
资料
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品类: 电子元器件分类描述: 导热接口产品 The High Performance Polyimide-Based Insulator, 0.006" Thickness, Adhesive - One Side, 19.05x10.41x5.72x3.96mm, Sil-Pad TSP K1300 Series / Also Known as Bergquist Sil-Pad K-10 Series38945+￥3.445225+￥3.190050+￥3.0114100+￥2.9348500+￥2.88382500+￥2.82005000+￥2.794410000+￥2.7562 -
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品类: 电子元器件分类描述: Q-PAD 3 .005" 12" X 12" SHEET; Packages Cooled: TO-220; Thermal Conductivity: 2W/m.K; Operating Temperature Range: -6...35041+￥60.615410+￥57.9799100+￥57.5055250+￥57.1366500+￥56.55681000+￥56.29322500+￥55.92425000+￥55.6080 -
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品类: 电子元器件分类描述: 导热接口产品 The High Performance Polyimide-Based Insulator, 0.010" Thickness, Sil-Pad TSP K1300 Series / Also Known as Bergquist Sil-Pad K-10 Series50015+￥5.502625+￥5.095050+￥4.8097100+￥4.6874500+￥4.60592500+￥4.50405000+￥4.463210000+￥4.4021 -
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品类: 电子元器件分类描述: GAP Pad® VO 超软 电绝缘体和导热体 适用于电气绝缘，并作为不同高度组件装配上的热接点 材料具有极好的弹性 可用厚度表示不同表面质地情况下的可用 GAP 垫 超软系列具有同样特性，但更为柔韧 GAP 垫 XX00S 系列为低压应用场合而设计 导热绝缘体（散热片）28051+￥340.947410+￥332.053150+￥325.2342100+￥322.8624200+￥321.0835500+￥318.71171000+￥317.22932000+￥315.7469 -
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品类: 电子元器件分类描述: 导热接口产品 Thermally Conductive, Silicone-Free Gap Filling Material, Gap Pad 1000SF, 8" x 16" Sheet, 0.080" Thickness29271+￥471.364310+￥459.067850+￥449.6406100+￥446.3615200+￥443.9022500+￥440.62321000+￥438.57372000+￥436.5243
